25-28 February 2019
The Telecom Infra Project (TIP) is bringing its hands-on innovation to Barcelona as the mobile community gathers for Mobile World Congress (MWC) 2019. A range of TIP supported technologies will feature across TIP member booths, and TIP Ecosystem Acceleration Center (TEAC) companies will exhibit at the startup-focused 4YFN conference. TIP will also unveil its first end-to-end network demonstration highlighting the interoperability of TIP technologies with new solutions from technology providers across Access, Backhaul, and Core.
For the full schedule of TIP activity — including Project Group meetings — please refer to our “Guide to MWC”. We are looking forward to seeing many of our TIP members in Barcelona!